Capabilities
Assembly, integration and test under one roof.
Resources to build, integrate and test electronics with quality control at every stage.
SMT and through-hole assembly
Board assembly with surface-mount and through-hole technology.
Fine-pitch and BGA
Automated placement of fine-pitch and BGA components.
Reflow soldering
Reflow oven for complex components, including lead-free processes.
Quality laboratory
Analysis and quality control of the materials used in production.
Analysis and Repair Center
The Analysis and Repair Center handles repairs, design adjustments and quality indicators.
Prototypes
Prototype builds to validate a design before volume production.
Memory programming
Memory programming integrated into the production process.
SKD and CKD integration
Final integration and assembly of products from SKD or CKD kits.
Mechanical assembly
Mechanical assembly of products and subassemblies.
Upgrades and reprogramming
Technology upgrades and software reprogramming of finished products such as phones, tablets and computers.
Pickup and delivery
Door-to-door logistics within a 200 km radius.
Design review
Design analysis with suggested alternatives and the right batch size for the partner's demand.